Neotronic

Ideal for wide variety of BGA, CSP, and MLF Packages.
Aries Electronics, an international manufacturer of standard, programmed and custom interconnection products, now offers machined high-frequency center probe test sockets to accommodate IC devices with a lead pitch of 0.30mm. With very low inductance and capacitance, the sockets are ideal for a wide variety of BGA (Ball Grid Array), CSP (Chip Scale Package), and MLF (Micro Lead Frame) packages.
Reduced inductance, increased board density and finer pitch array packages are made possible thanks to a four-point crown or sharp point gold plated 0.30mm pitch probe pin, spring and flanged bottom pin, which contacts the tail of the probe pin to shorten the signal path. A signal path of just 0.077 inches (1.96mm) allows for minimal signal loss and higher bandwidth capacity with the new Aries’ machined high-frequency sockets.
The solderless pressure mount spring probes allow easy mounting of the socket to a test board and device solder ball or pad, while socket locating posts ensure accurate positioning of the socket to the board. The sockets are equipped with chip guides to allow exact device location and four-point edge male contacts for precise mating of the device. The socket’s small footprint ensures maximum use of the test board area for increased efficiency.
Spring loaded contacts, made of gold-plated beryllium-copper, provide a high life cycle of up to 500,000 cycles. Socket body material is Torlon PAI and all hardware is stainless steel.
The socket’s contact forces are 15g per contact on a 0.30mm to 0.35mm pitch, 16g per contact on a 0.40mm to 0.45mm pitch and 25g per contact on a 0.50mm pitch or larger. Contact resistance is less than 40 milliohms. Probe self-inductance on the new socket is 0.51nH for large probes and 0.59nH for small probes.
The socket accepts solder ball sizes from 0.15mm to 0.93mm. Insertion loss is 1dB to 10.1GHz for a larger probe at 0.80mm pitch and 1dB to 18.7GHz for a smaller probe at 0.50mm pitch.
For additional information, please kindly contact us.

Neo_Tech Neotronic News

Integration of Previously Incompatible Pitch Devices and Boards Saves Resources, Time and Money
Aries Electronics, an international manufacturer of standard, programmed and custom interconnection products, now offers a line of adapters which convert TSSOP, QFP and other fine pitch devices to any other fine-pitch bumped package or routing configuration down to 0.4mm pitch.
These unique Fine Pitch Bump Adapters are mounted to the existing PCB via raised pads up to 0.010″ (0.25mm) on the adapter bottom. The adapters feature pads on the component side designed to accept any device on any pitch (0.5mm or greater) and easily route the signals for packages including TSSOP, QFP and other fine-pitch devices down to 0.40mm.
In addition to simple circuit correction, other active or passive components can be added to the adapter to facilitate a more complex or custom adaptation via the open space available at the top of the adapter board. This extra space allows for easy conversion of the original design saving both time and money.
The Aries’ Fine Pitch Bump Adapter boards are 0.032″ (0.813mm) thick FR-4 or Rogers 370HR, with ½-oz. copper traces on both sides. The non-solder mask defined (NSMD) pads are finished with electroless nickel immersion gold (ENIG). The adapters can operate up to 221°F (105°C) for FR-4 and 266°F (130°C) for lead-free.
The new adapters are available on tape-and-reel for high-speed SMT assembly and can be manufactured for RoHS compliance. Standard line and trace spacing down to 0.003″ (0.076mm) can be used.
Fine Pitch Bump Adapters are available in panelized form, as an adapter only, or as a turnkey solution with devices mounted. Aries specializes in custom design and production. In addition to standard products, special materials, platings, sizes and configurations can be furnished depending on quantity.
For additional information, please kindly contact us.

Neo_Tech Neotronic News

Neotronic, S. A., distribuidor oficial de Edison Opto para España y Portugal, presenta la nueva serie EdiPower de  leds de alta potencia de 4W a 50W.

Destacados por su bajo consumo de electricidad, su larga vida, su fiabilidad y su gran versatilidad de funcionamiento, el EdiPower II ofrece  varias intensidades  de luminosidad para poder ser utilizado  en una amplia gama de iluminación.

Este nuevo diseño de la serie  EdiPower II cubre desde 410 lúmenes hasta 4.100 lúmenes, este margen de luminosidad abarca la iluminación de interiores e interiores, iluminación urbana e iluminación industrial.

Está especialmente diseñado para sustituir lámparas incandescentes, lámparas halógenas, lámparas de descarga, fluorescentes, etc. Además al estar fabricado sobre sustrato de cobre facilita mucho el montaje.

Tiene una eficacia lumínica de más de 100lm/W, lo cual satisface la mayor parte de necesidades de iluminación.

La serie de 410-540 lm es ideal para sustituir las fuentes luminosas convencionales como lámparas halógenas y de mercurio. La serie de 850-1.400 lm puede sustituir las lámparas MR16, Spot Light y retroiluminación. La serie de 1.450-4.100 lm esta especialmente indicada para proyectores,  para iluminación de grandes espacios,  para iluminación arquitectónica, etc.

A continuación se muestra una tabla con las características principales resumidas de cada modelo:

Neo_Tech Novedades alta luminosidad, alta potencia, led 50w, led mutichip

Keystone Electronics Corp. has introduced a new line of Vertical Entry, Lithium Coin Cell Holders, for use with portable medical and other electronic devices.

Designed to retain cells securely under shock and vibration, these holders feature flame retardant housings UL rated 94V-0 and dual-spring contacts with low contact resistant. These contacts are made of spring steel with tin plating. Sizes available for : 16mm [p/n 1069], 20mm [p/ns 1065 & 1067] and 24mm [p/n 1068] diameter coin cell batteries. These rugged holders are polarized for circuit protection and will accept all major manufacturers’ batteries.

Keystone Electronics designs and manufactures more than 5 000 interconnect components and hardware while providing stamping, machining and assembly services for required modifications and special design needs. An in-house application engineering group facilitates these capabilities.

For more details, please contact comercial@neotronic.com

Neo_Tech Neotronic News ce, cell holder, portapilas

Edison Opto, a leading high power LED package manufacturer in Taiwan, offers custom design options to its EdiPower® II series. Base on various application requirements, the multi-chips EdiPower® II package can be adjusted in total power, operating current and driving voltage of choice.
Standard EdiPower®  II includes four types of  model: 4~6W, 8~15W, 16~24W and 30~50W. The custom EdiPower® II package can be designed to allow flexibility in adaption to different power source driven parameters such that the package can  enable operation in high voltage. This kind of specific package not only simplifies the power circuit needed to drive the package, but also enhances the power circuit efficiencies.
Power circuit design for the custom high voltage EdiPower® II series is especially easy and cost-effective. Through proprietary LED package process and experiences, the efficiency of the package can reach up to 120lm/W; while the power circuit solution can also yield higher efficiency for less heat is being generated by the difference in power loss associated with voltage drop from input source to LED package.
Custom high voltage designed EdiPower® II is ideal for application together with integrated circuit design within luminaries or light bulbs. For the generated heat from circuit can be reduced, the integrated heat-sink would result in higher heat capacity and dissipation. Heat from LEDs would sustain longer lifetime for reduced temperature generated from the power circuit. Number of applications for EdiPower® II include down-light and retrofit light bulbs.

For information about custom EdiPower® package design, please contact us at：

comercial@neotronic.com

Neo_Tech Neotronic News

The latest innovation from Keystone Electronics Corp. is its new miniature, screw terminal type binding post suited for 22-15AWG wire and used in high density PCB packaging.

Rated 15Amps, this compact, low profile design facilitates a broad range of capabilities for a number of applications with space-saving, cost-effective versatility.

Made of tin plated brass and a zinc plated screw, these new screw terminal binding posts are supplied assembled or unassembled. P/n #8737 is supplied completely assembled with a screw and wire retention contact to aid in preventing wire damage. P/n #8730 is supplied with an unassembled post and screw.

Keystone Electronics designs and manufactures more than 5 000 interconnect components and hardware while providing stamping, machining and assembly services for required modifications and special design needs. An in-house application engineering group facilitates these capabilities.

Neo_Tech Neotronic News